Electric double layer capacitor and method for preparing the same

ABSTRACT

An electric double layer capacitor is disclosed which is capable of preventing transmission of an electrolytic solution vaporized in a basic cell through current collectors and capable of improving a yield. A method for preparing the electric double layer capacitor is also disclosed. The electric double layer capacitor comprises a basic cell prepared by the steps of: applying a current collector onto a surface of a substrate; disposing an electrically insulating gasket element on the surface the substrate in such a manner that the current collector laterally abuts on the gasket element to define a concavity; placing a polarizable electrode impregnated with an electrolytic solution on the surface of the current collector; oppositely disposing two intermediate products prepared through the foregoing steps on a separator in such a manner that the gasket elements abut on surfaces of a peripheral portion of the separator; fusion-bonding the gasket elements together to laterally cover the separator with the resulting unified gasket; and removing the substrates from the current collectors and the gasket. The substrate has a vapor transmission rate of a predetermined one or lower with respect to the electrolytic solution vaporized at a temperature of the fusion-bonding.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an electric double layercapacitor and a method for preparing the same.

[0003] 2. Description of the Prior Art

[0004] Heretofore, electric double layer capacitors have been put topractical use as capacitors which enable obtaining high capacities offarad(F)-order without involving chemical reaction and which endurecharge and discharge of heavy currents and charge-and-discharge cycles.

[0005] In recent years, with a view to making good use of electricdouble layer capacitors, studies on new applications thereof as anauxiliary power supply of an electronic appliance such as a cellularphone. Concomitantly therewith, further miniaturization and capacityincrease of electric double layer capacitors have been attempted.

[0006] As shown in FIG. 4, a conventional electric double layercapacitor comprises a basic cell 10 including a porous separator 11 inthe form of a sheet; a pair of current collectors in the form of a sheetdisposed oppositely relative to the separator 11; a pair of polarizableelectrodes 13, 13 having a plate-like form and disposed between theseparator and the current collectors; and gasket 14 which is laterallycontiguous to the separator 11 and the polarizable electrodes 13, 13 andheld between the current collectors 12, 12. The basic cell 10 is sealedwith an electrolytic solution contained therein.

[0007] In most cases, the gasket 14 is prepared from two gasket elements141, 141 for manufactural reason.

[0008] In the next place, a method for preparing a conventional electricdouble layer capacitor will be described with reference to FIG. 4.

[0009] FIGS. 4(a) to 4(g) are sectional views schematically showing apart of a method for preparing a conventional electric double layercapacitor.

[0010] As shown in FIG. 4(a), a current collector 12 in the form ofsheet is provided and, as shown in FIG. 4(b), it is cut down to size.

[0011] As the current collector 12, an electrically conductive film isgenerally employed which comprises an electrical insulating resin andelectrically conductive particles. With respect to material and methodfor the production thereof, there maybe employed conventionaltechniques, for example, disclosed in Japanese Unexamined PatentPublication Nos.1998-4033 and 1998-4034 by Nagaki et al.

[0012] Further, as disclosed in U.S. Pat. No. 6,377,441 by Ohya et al.,a laminate prepared by laminating a plurality of current collectors 12may be employed.

[0013] Moreover, as materials suitable for the current collector, thosedisclosed in PCT/JP98/01021 and PCT/JP98/03073 may be employed.

[0014] Then, as shown in FIG. 4(c), a gasket element 141 in the form ofa frame, i.e., a gasket element 141 having an opening is disposed on thesurface of the current collector 12. Since the gasket element 141 isdisposed on a peripheral portion of the surface of the current collector12, a portion of the surface of the current collector 12 within theopening remains uncovered.

[0015] Then, as shown in FIG. 4(d), a polarizable electrode 13 isprovided on the uncovered portion of the surface of the currentcollector 12 and, as shown in FIG. 4(e), a separator 11 is so disposedon the gasket element 141 as to cover the opening of the gasket element141.

[0016] Thereafter, as shown in FIG. 4(f), another product as shown inFIG. 4(d) is disposed on the separator 11 in such a manner that innerportions of the gasket elements 141, 141 of the two products as shown inFIG. 4(d) oppositely abut on the separator 11, and the gasket elements141, 141 are subjected to thermo-compression bonding from both sides viathe current collectors 12, 12.

[0017] The gasket elements 141, 141 are deformed so that outer portionsof the gasket elements 141, 141 vertically extend all around theseparator 11, and the gasket elements 141, 141 are fusion-bondedtogether into a gasket 14. As a result, the separator 11 is laterallycovered with the gasket 14 all around to thereby obtain an electricdouble layer capacitor as shown in FIG. 4(g).

[0018] In recent years, miniaturization of electronic parts has beenadvanced. In particular, the advents of small-sized electric doublelayer capacitors having high capacities and the like have strongly beendesired as described above.

[0019] However, according to the conventional method for preparing anelectric double layer capacitor, if it has been intended to prepare anelectric double layer capacitor as a small-sized capacitor with a highcapacitor, there have been limitations in size and in mechanicalstrength which are attributed to the preparation method.

[0020] Specifically, a current collector used in a conventional electricdouble layer capacitor has been a butyl rubber containing a carbonpowder in most cases. With respect also to a gasket, a butyl rubber hasbeen used because of its affinity with the current collector.

[0021] If a current collector and a gasket which are made of a butylrubber or the like have been miniaturized in order to advanceminiaturization of electric double layer capacitors, there has been aproblem in poor mechanical strength in the fusion-bonding step or thelike. This has created a limitation on miniaturization of electricdouble layer capacitors.

[0022] Further, if each of members including a current collector hasbeen reduced to too thin a film with an intention to miniaturizeelectric double layer capacitors, transmission of electrolytic solutionvaporized in the step of thermo-compression bonding has been liable tooccur. As a result, there have been undesirable variations in equivalentseries resistance (ESR). This leads to a lowered yield of electricdouble layer capacitors as products.

SUMMARY OF THE INVENTION

[0023] It is, therefore, an object of the present invention to solve theabove-described problems caused concomitantly with miniaturization of anelectric double layer capacitor and to provide an electric double layercapacitor, which is adaptable to miniaturization and which has a highcapacity and stable characteristics such as ESR, and a method forpreparing the same.

[0024] According to an embodiment of the present invention, an electricdouble layer capacitor has such a structure that current collectors asconstituents of a basic cell laterally abut on a gasket. Accordingly,the current collectors do not undergo excess deformations by pressureswhich are exerted on the basic cell in the thickness direction thereofin the course of the preparation thereof, and hence leakage of theelectrolytic solution is less likely to occur.

[0025] According to another embodiment of the present invention, anelectric double layer capacitor is prepared by the preparation methodincluding steps of forming a structure comprising a current collectorand a gasket element which are applied on the same substrate.Accordingly, occurrence of defects in a step of fusion-bonding in thepreparation of the electric double layer capacitor is suppressed even ifthe electric double layer capacitor is miniaturized, and hence highproductivity of the electric double layer capacitor is realized.

BRIEF DESCRITION OF THE DRAWINGS

[0026] FIGS. 1(a) and 1(b) are sectional views schematically showingstructures of an embodiment of the electric double layer capacitor and abasic cell thereof according to the present invention, respectively;

[0027] FIGS. 2(a) to 2(f) are sectional views schematically showing acharacteristic part of an embodiment of the method for preparing anelectric double layer capacitor according to the present invention;

[0028] FIGS. 3(a) to 3(g) are sectional views schematically showing acharacteristic part of another embodiment of the method for preparing anelectric double layer capacitor according to the present invention; and

[0029] FIGS. 4(a) to 4(g) are sectional views schematically showing apart of a method for preparing a conventional electric double layercapacitor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In the following, an embodiment of the electric double layercapacitor and a basic cell thereof according to the present inventionwill be described with reference to the drawings.

[0031] FIGS. 1(a) and 1(b) are sectional views schematically showingstructures of an embodiment of the electric double layer capacitor and abasic cell thereof according to the present invention, respectively.

[0032] As shown in FIG. 1(a), the electric double layer capacitoraccording to the present invention comprises at least one basic cell 10.By way of illustration, the embodiment comprising a cell structure 20prepared by laminating 5 basic cells will be specifically described. Oneach of the outer surfaces of the outermost current collectors 12, 12 ofthe cell structure an electrode plate 21 provided with a lead terminalis attached. The cell structure 20 provided with the electrode plates21, 21 is packaged in an outer packaging 22 with end portions of thelead terminals out. In general, the packaging is carried out underreduced pressure.

[0033] The electrode plate 21 provided with a lead terminal is made ofcopper and has its surfaces plated with solder. The electrode plate 21comprises an electrode plate 24 having a tetragonal plate-like form anda lead terminal 25 having a ribbon-like form and extending from theelectrode plate 24. The electrode plate bodies 24, 24 are bonded to theouter surfaces of the outermost current collectors 12, 12 of the cellstructure 20 in terms of the thickness direction of the cell structure20 with an electrically conductive adhesive or the like, respectively.

[0034] The outer packaging 22 is made of a laminated film prepared bylaminating aluminum and an electrical insulating resin in such a mannerthat the resin constitutes the surfaces of the laminated film.

[0035] As shown in FIG. 1(b), the basic cell 10 comprises a separator 11having a substantially planar form; a pair of current collectors 12, 12having a plate-like form and disposed oppositely relative to theseparator 11 and in parallel with the separator 11; a pair ofpolarizable electrodes 13, 13 having a plate-like form and disposedbetween the separator 11 and the current collectors 12, 12; and a gasket14 in the form of a frame disposed in such a manner that gasket 14 islaterally contiguous to the separator 11 and the current collectors 12,12 to accommodate the polarizable electrodes in a pair of closedvacancies defined by the separator 11, the current collectors 12, 12 andthe gasket 14. One of the polarizable electrodes 13, 13 is therebyaccommodated in one of the closed vacancies and the other polarizableelectrode 13 in the other closed vacancy, and each of the vacanciescontains an electrolytic solution.

[0036] In the electric double layer capacitor comprising at least onebasic cell 10 having the above-described structure, the gasket 14 mainlysustains forces pressed (on the basic cell 10) in the direction of thethickness of the basic cell 10 in the course of the preparation of theelectric double layer capacitor, for example, in the bonding of thebasic cell 10 with the electrode plate 24 and in the bonding of thebasic cell 10 with another basic cell 10. Accordingly, since the currentcollectors 12, 12 do not undergo excess deformation such as distortionin the preparation of the electric double layer capacitor, breakage ofthe basic cell 10 and leakage of the electrolytic solution containedtherein are not liable to occur.

[0037] When the outer surface of each of current collectors 12, 12 ofthe basic cell 10 is substantially coplanar with the nearer end surfaceof the gasket 14 or apart from the plane including the nearer endsurface of the gasket 14 at a distance of about 20 μm or smaller, theabove-described effects are remarkable. In other words, both endsurfaces of the gasket 14 protrudes from the adjacent surfaces ofcurrent collectors 12,12 of the basic cell 10 through 20 μm at most.

[0038] If the distance is larger than about 20 μm, voids are likely toformed at the interface between basic cells 10,10 in the preparation ofthe the electric double layer capacitor, for example, in the laminationof the basic cell 10 with another basic cell 10.

[0039] Further, it is preferred that each of the thickness of thecurrent collectors 12, 12 of the basic cell 10 having theabove-described structure be from about 15 μm to about 100 μm. When sizereduction of a capacitor is advanced, constituents thereof are reducedin size concomitantly therewith. In such a situation, if the currentcollector 12 has a thickness of larger than about 100 μm, electricalresistance of (a material of) the current collector 12 itself is high.Consequently, basic electrical characteristics of the capacitor isimpaired. On the other hand, if the current collector 12 has a thicknessof smaller than about 15 μm, mechanical strength thereof is considerablylowered. This leads to a decrease in yield.

[0040] Further, it is preferred that quotient obtained by dividing thevalue resulting from subtraction of the thickness of the polarizableelectrode 13 from the distance between the current corrector 12 and theseparator 11 by the thickness of the separator 11 be in a range of about0.2 to about 0.6. With respect to the capacitor having such a structuralfeature, ESR is low, and leakage of the electrolytic solution is lesslikely to occur.

[0041] If the value of the quotient is smaller than about 0.2, bondbetween gasket elements (which are unified by fusion-bonding to form thegasket 14 as described hereinbelow) and bonds between the gasket 14 andthe current collectors 12, 12, which bonds are made by fusion-bonding inthe preparation of the basic cell 10, are likely to be insufficient.This leads to a decrease in yield in the preparation of the basic cell10. On the other hand, if the value of the quotient is larger than about0.6, ESR is high. This results in lowering of the quality of the basiccell 10.

[0042] The gasket 14 is preferably made of a resin having a transparencyof such a degree that the contents of the closed vacancies can be seenthrough the gasket to thereby allow visual check of electrolyticsolution leakage or the like. This enables easily detecting basic cells10 which have become defective in the course of the preparation thereof,contributing to improvement of quality of the basic cell 10.

[0043] More preferably, the gasket 14 is made of a colorless andtransparent polyolefin film. A polyolefin film satisfies specificationswhich the gasket is required to have in chemical properties, thermalproperties and mechanical strength. Further, a polyolefin film is easilyand stably provided as a colorless and transparent material, therebyleading to stabilized preparation.

[0044] Still more preferably, the gasket 14 is made of a colorless andtransparent polyolefin film made of an ionomer. An ionomer is a resincontaining metal ions located at cross-linked positions, and the gasket14 made of such a resin has a specific gravity of about 0.93 to about0.97. Accordingly, the gasket element 141 made of an ionomer on thesubstrate 100 is easier to handle in the preparation of the basic cell10 as compared with a conventional gasket element made of a polyethylenewhich mostly has a specific gravity of about 0.91 to about 0.93. Thisleads to lowered percent defective in the fusion-bonding step.

[0045] In the next place, an embodiment of the method for preparing anelectric double layer capacitor according to the present invention willbe described below with reference to the drawings.

[0046] FIGS. 2(a) to 2(f) are sectional views schematically showing anembodiment of the method for preparing an electric double layercapacitor according to the present invention.

[0047] As shown in FIG. 2(a), first, a current collector 12 having aplate-like form is applyed onto a surface of a substrate 100 having asurface area larger than that of the current collector 12, if desired,with a release agent or the like interposed therebetween. The resultinguncovered marginal portion of the substrate 100 formed around thecurrent collector 12 when viewed in plan has such a form that a gasketelement 141 which will be described below is disposed on the uncoveredmarginal portion.

[0048] It is preferred that the current collector 12 be an electricallyconductive film made of a styrene-ethylene-butylene-stylene copolymerresin containing a carbon powder.

[0049] Then, as shown in FIG. 2(b), the gasket element 141 in the formof a frame having an opening for accommodating the current collector 12is disposed on the uncovered marginal portion of the substrate 100 insuch a manner that the current collector 12 laterally abut on the gasketelement 141 to define a concavity. The gasket element 141 and thecurrent collector 12 are fusion-bonded. The fusion-bonding is carriedout, for example, at a temperature of 120° C. for 10 minutes.

[0050] The gasket element 141, two of which will be fusion-bonded toform a gasket 14 as described later, is preferably made of a resinhaving a transparency of such a degree that the contents of the closedvacancies can be seen through the gasket to thereby allow visual checkof electrolytic solution leakage or the like. This enables easilydetecting basic cells 10 which have become defective in the course ofthe preparation thereof, contributing to improvement of quality of thebasic cell 10.

[0051] More preferably, the gasket element 141 is made of a colorlessand transparent polyolefin film. A polyolefin film satisfiesspecifications, which the gasket is required to have in chemicalproperties, thermal properties and mechanical strength. Further, apolyolefin film is easily and stably provided as a colorless andtransparent material, thereby leading to stabilized preparation.

[0052] Still more preferably, the gasket element 141 is made of acolorless and transparent polyolefin film made of an ionomer. An ionomeris a resin containing metal ions located at cross-linked positions, andthe gasket element 141 made of such a resin has a specific gravity ofabout 0.93 to about 0.97. Accordingly, the gasket element 141 made of anionomer (resin) on the substrate 100 is easier to handle in thepreparation of the basic cell 10 as compared with a conventional gasketelement made of a polyethylene which mostly has a specific gravity ofabout 0.91 to about 0.93. This leads to lowered percent defective in thefusion-bonding step.

[0053] Then, as shown in FIG. 2(c), a polarizable electrode 13impregnated with an electrolytic solution is placed in the concavitydefined by the current collector 12 and the gasket element 141. Thepolarizable electrode 13 has such a thickness that the surface of thepolarizable electrode 13 placed on the current collector 12 is locatedbelow the upper end surface of the gasket element 141.

[0054] Then, as shown in FIG. 2(d), a separator 11 having asubstantially planar form is mounted on the gasket element 141 in such amanner that the gasket element 141 abuts on a surface of a peripheralportion of the separator 11 and that an uncovered portion of the upperend surface of the gasket element 141 is formed around the separator 11when viewed in plan.

[0055] Each of the gasket elements 141 preferably has such a thicknessthat quotient obtained by dividing the value resulting from subtractionof the thickness of the polarizable electrode 13 from the distancebetween the current collector 12 and the separator 11 by the thicknessof the separator 11 is in a range of about 0.2 to about 0.6.

[0056] By virtue of such a structural feature, equivalent seriesresistance (ESR) stands low, and leakage of the electrolytic solution isless likely to occur.

[0057] If the value of the quotient is smaller than about 0.2, bondbetween the gasket elements 141, 141 and bond between the gasket element141 and the current collectors 12, which bonds are made byfusion-bonding in the preparation of the basic cell 10, are likely to beinsufficient. This leads to a decrease in yield in the preparation ofthe basic cell 10.

[0058] On the other hand, if the value of the quotient is larger thanabout 0.6, ESR is high. This results in lowering of the quality of thebasic cell 10.

[0059] Subsequently, as shown in FIG. 2(e), another intermediate productprepared through the steps of FIG. 2(a) to FIG. 2(c) is mounted on theseparator 11 in such a manner that the two intermediate products areoppositely disposed on the separator 11. In this case also, thecounterpart intermediate product is disposed in such a manner that thegasket element 141 abuts on a peripheral portion of the separator 11 andthat an uncovered portion of the end surface of the gasket element 141which end surface is distal to the substrate 100 is formed around theseparator 11 when viewed in plan.

[0060] In other words, the two intermediate products prepared throughthe steps of FIG. 2(a) to FIG. 2(c) are so disposed as to hold theseparator 11 therebetween with the polarizable electrodes 13 oppositelydisposed relative to the separator 11.

[0061] Then, the gasket elements 141, 141 of the two intermediateproducts are fusion-bonded together into a gasket 14 to prepare a basiccell 10 with the substrates 100, 100, and the substrates 100, 100 areremoved therefrom to obtain the basic cell 10 as shown in FIG. 2(f).

[0062] Subsequently, an electric double layer capacitor is prepared asfollows, although the process is not shown in Figs. A cell structurecomprising a laminate of a plurality of basic cells 10 is prepared. Oneach of the outer surfaces of the outermost current correctors 12, 12 ofthe cell structure 20 in terms of the thickness direction of the cellstructure 20, an electrode plate 24 of a lead terminal/electrode plateassembly 21 is disposed. Heating is performed at a predeterminedtemperature (for example, 85° C.) for a predetermined period of time(for example, 2 hours) to thereby unify the electrode plates eachprovided with a lead terminal with the cell structure 20.

[0063] Thereafter, the lead terminal/electrode plate assemblies 21, 21and the cell structure 20 which have been unified is packaged in anouter packaging with end portions of the lead terminals out byfusion-bonding a peripheral protion of the outer packaging in anatmosphere having reduced pressure to seal the outer packaging. Anelectric double layer capacitor 1 is thereby completed.

[0064] In this embodiment, the cell structure comprising a laminatedbasic cells is described. However, the cell structure may comprise asingle basic cell having its surfaces each provided with an electrodeplate 24.

[0065] The above-described method is innovative in that pressures arenot directly applied to the members constituting the basic cell 10 butapplied to the members via the substrates 100, 100 in the preparation ofthe basic cell 10. When the basic cell 10 is miniaturized, mechanicalstrengths of the members of the basic cell 10 which include the currentcollectors 12, 12 are lowered concomitantly with the miniaturization.However, since the substrates 100, 100 serve as reinforcing members forthe current collectors 12, 12 and the gasket elements 141, 141 tosupport these members, the current collectors 12, 12 and the gasketelements 141, 141 are less likely to undergo separation therebetween ordeformation thereof by pressures applied thereto in the preparation ofthe basic cell 10. This leads to increased productivity of the basiccell 10.

[0066] Further, by the use of the substrates 100, 100, a phenomenon oftransmission of vaporized electrolytic solution through the currentcollectors 12, 12 is suppressed which is caused in the fusion-bonding(step). When the members are reduced in size, the phenomenon becomesconsiderable. However, this problem can be solved by using a materialwhich is resistant to transmission of vaporized electrolytic solutiontherethrough for the substrates 100, 100.

[0067] The thickness of the substrate 100 depends on materials. However,when PET is used, a thickness of about 100 μm is sufficient.

[0068] Accordingly, a material for the substrate 100 preferably has suchphysical properties that the substrate 100 has a vapor transmission rateof about 10 mg/m²/24 h or lower measured in accordance with JIS Z 0206test method when diluted sulfuric acid is used as the electrolytesolution. In other words, amount of the transmitted vaporizedelectrolytic solution is about 10 mg or smaller in 24 hours per m². Byusing the material having such properties for the substrate 100 in theabove-described method, the basic cells 10 show a small range ofvariation in performance, particularly in ESR even if the basic cells 10are miniaturized.

[0069] Of materials which satisfy suitability as the reinforcing memberand the level of the transmission rate, it is particularly preferred touse a polyethylene terephthalate (PET) film as the substrate 100. A PETfilm not only satisfies the suitability and the level because of itsexcellent mechanical strength and a low vapor transmission rate but alsoshows a small dimensional change by thermal stress. Accordingly,precision and yield in the preparation are maintained at high levelseven if the basic cell 10 is miniaturized. With respect to the thicknessthereof, a thickness in a range of about 15 μm to about 200 μm ispreferable and about 100 μm is more preferable.

[0070] If the substrate 100 has a small thickness and a vaportransmission rate of higher than about 10 mg/m²/24 h, there is a highpossibility that leakage of the electrolytic solution becomenon-negligible to impair basic characteristics of the capacitor. thesubstrate 100 with a thickness higher than about 200 μm is lessappropriate for the preparation of a basic cell 10.

[0071] It is preferred that prior to the step of removing the substratesin the above-described method, the following steps of heating andcooling be carried out because occurrence of defects in the step ofremoving is inhibited.

[0072] When the current collectors 12, 12 having a glass transitiontemperature higher than that of the substrates 100, 100 are used, thesteps of heating and cooling are preferably carried out prior to thestep of removing the substrates in such a manner that the structure intowhich the substrates 100, 100, the current collectors 12, 12, the gasket14 and the separator 11 are united, i.e., the structure resulting fromthe step of fusion-bonding the gasket elements is placed in anenvironment having a temperature which is equal to the glass transitiontemperature of the substrates 100, 100 or higher and which is lower thanthe glass transition temperature of the current collectors 12, 12, andsubsequently, the resultant is placed in an environment having atemperature which is room temperature or lower.

[0073] By employing these steps, adhesion between the current collectors12, 12 and the substrates 100, 100 is weakened due to the differencebetween the glass transition temperature of the current collectors 12,12 and that of the substrates 100, 100, and accordingly, the substrates100, 100 are easily removed from the current collectors 12, 12.

[0074] In the following, another embodiment of the method for preparingan electric double layer capacitor according to the present inventionwill be described with reference to the drawings.

[0075] FIGS. 3(a) to 3(g) are sectional views schematically showinganother embodiment of the method for preparing an electric double layercapacitor according to the present invention.

[0076] This embodiment of the present invention is mainly employed inso-called “multiple-piece preparation” in which a sheet of film forcurrent collectors and a substrate in the form of a sheet of film areused each of which sheets has a sufficient size for this purpose, and aplurality of products are prepared therefrom.

[0077] As shown in FIG. 3(a), first, the sheet of film for currentcollectors 12 having a plate-like form is applied onto the surface ofthe substrate 100 in the form of a sheet of film, if desired, with arelease agent or the like interposed therebetween.

[0078] In this connection, it is preferred that the current collector 12be an electrically conductive film made of astyrene-ethylene-butylene-stylene copolymer resin containing a carbonpowder.

[0079] Then, as shown in FIG. 3(b), cutting only the sheet of film forcurrent collectors 12 which has been applied onto the substrate 100,i.e., so-called “halfway cutting” is conducted to form currentcollectors 12 and an uncovered portion of the surface of the substrate100 around the current collectors 12 when viewed in plan so that afterthe cutting, the current collectors 12 are conformable with openings ofgasket elements 141 and the uncovered portion between adjacent currentcollectors 12 has such a width as to permit gasket elements 141 for theadjacent current correctors 12 to be disposed without interfering witheach other. This arrangement enables the current collectors 12 to be enbloc subjected to the following steps.

[0080] Thereafter, as shown in FIG. 3(c), with respect to each of thecurrent collectors 12, a gasket element 141 in the form of a framehaving an opening for accommodating the current collector 12 is disposedon the uncovered portion of the substrate 100 around the currentcollector 12 in such a manner that the current collector 12 laterallyabut on the gasket element 141 to define a concavity. The gasket element141 and the current collector 12 are fusion-bonded. Conditions for thefusion-bonding is such that the fusion-bonding is carried out, forexample, at a temperature of 120° C. for 10 minutes.

[0081] After the fusion-bonding, the gasket element 141 has an openingfor accommodating the current collector 12 and is disposed on thesurface of the substrate 100 in such a manner that the current collector12 is fitted in the opening.

[0082] The gasket element 141, two of which will be fusion-bonded toform a gasket 14 as described later, is preferably made of a resinhaving a transparency of such a degree that the contents of the closedvacancies can be seen through the gasket to thereby allow visual checkof electrolytic solution leakage or the like. This enables easilydetecting basic cells 10 which have become defective in the course ofthe preparation thereof, contributing to improvement of quality of thebasic cell 10.

[0083] More preferably, the gasket element 141 is made of a colorlessand transparent polyolefin film. A polyolefin film satisfiesspecifications which the gasket is required to have in chemicalproperties, thermal properties and mechanical strength. Further, apolyolefin film is easily and stably provided as a colorless andtransparent material, thereby

[0084] Still more preferably, the gasket element 141 is made of acolorless and transparent polyolefin film made of an ionomer. An ionomeris a resin containing metal ions located at cross-linked positions, andthe gasket element 141 made of such a resin has a specific gravity ofabout 0.93 to about 0.97. Accordingly, the gasket element 141 made of anionomer on the substrate 100 is easier to handle in the preparation ofthe basic cell 10 as compared with a conventional gasket element made ofa polyethylene which mostly has a specific gravity of about 0.91 toabout 0.93. This leads to lowered percent defective in thefusion-bonding step.

[0085] Then, as shown in FIG. 3(d), a polarizable electrode 13impregnated with an electrolytic solution is placed in each of theconcavitis defined by the current collectors 12 and the gasket elements141. The polarizable electrode 13 has such a thickness that the (upper)surface of the polarizable electrode 13 placed on the current collector12 is located below the upper end surface of the gasket element 141. Theresulting product is referred to as an intermediate product.

[0086] Then, as shown in FIG. 3(e), a separator 11 having asubstantially planar form is mounted on each of the gasket elements 141at a predetermined distance from the polarizable electrode 13 in such amanner that the gasket element 141 abuts on a surface of a peripheralportion of the separator and that an uncovered portion of the upper endsurface of the gasket element 141 is formed around the separator 11 whenviewed in plan.

[0087] Each of the gasket elements 141 preferably has such a thicknessthat quotient obtained by dividing the value resulting from subtractionof the thickness of the polarizable electrode 13 from the distancebetween the current collector 12 and the separator 11 by the thicknessof the separator 11 is in a range of about 0.2 to about 0.6.

[0088] By virtue of such a structural feature, ESR stands low, andleakage of the electrolytic solution is less likely to occur.

[0089] If the value of the quotient is smaller than about 0.2, bondbetween the gasket elements 141, 141 and bond between the gasket element141 and the current collectors 12, which bonds are made byfusion-bonding in the preparation of the basic cell 10, are likely to beinsufficient. This leads to a decrease in yield in the preparation ofthe basic cell 10.

[0090] On the other hand, if the value of the quotient is larger thanabout 0.6, ESR is high. This results in lowering of the quality of thebasic cell 10.

[0091] Further, as shown in FIG. 3(f), in one mode of this step, anotherintermediate product as a counterpart intermediate product preparedthrough the steps of FIG. 3(a) to FIG. 3(d) and subsequent separationinto individual intermediate products is mounted on the separator 11 insuch a manner that the gasket element 141 of the counterpartintermediate product abuts on the other surface of the peripheralportion of the separator 11 and that an uncovered portion of the endsurface of the gasket element 141 which end surface is distal to theindividual substrate 100 a is formed around the separator 11 when viewedin plan.

[0092] In other words, the two intermediate products prepared throughthe steps of FIG. 3(a) to FIG. 3(d) and the subsequent separation intoindividual intermediate products are so disposed as to hold theseparator 11 therebetween with the polarizable electrodes 13 oppositelydisposed relative to the separator 11.

[0093] In another mode of this step, another product prepared throughthe steps of FIG. 3(a) to FIG. 3(d) which is not separated intoindividual intermediate products, i.e., a substrate 100 withintermediate products formed thereon is used as a counterpart substrate100 with counterpart intermediate products formed thereon (hereinafterreferred to as counterpart combination). The counterpart combination ismounted on the separators 11 in such a manner that each intermediateproduct on which one of the separators 11 is disposed and itscounterpart intermediate product are oppositely disposed on theseparator 11 and that each of the counterpart intermediate products isdisposed on the separator 11 in the same manner as the counterpartintermediate product in the one mode of this step. In this connection,the counterpart intermediate products are formed on the counterpartsubstrate 100 in such an arrangement that each intermediate product onwhich one of the separators 11 is disposed is paired with one of thecounterpart intermediate products when the counterpart combination ismounted on the separators 11. Each of the paired intermediate productswith the separator 11 interposed therebetween in this mode is subjectedto the following steps in the same manner as the two intermediateproducts with the separator interposed therebetween in the one mode ofthis step. This mode facilitates to en bloc subject the pairedintermediate products with the separator interposed therebetween to thenext step.

[0094] Then, the gasket elements 141, 141 of the two intermediateproducts are fusion-bonded together into a gasket 14 to prepare a basiccell 10 with the substrate 100 and the individual substrate 100 a, andthe substrates 100, 100 a are removed therefrom to obtain the basic cell10 as shown in FIG. 3(g). It is to be noted that a plurality of currentcollectors on the substrate in the step of FIG. 3(b), the resultingproducts on the substrate from each of the steps of FIGS. 3(c) and (e)and the resulting products on (between) the substrates from the step ofFIG. 3(f) may be separately or en bloc subjected to the next steps,respectively.

[0095] Subsequently, an electric double layer capacitor is prepared asfollows, although the process is not shown in Figs. A cell structurecomprising a laminate of a plurality of basic cells 10 is prepared. Oneach of the outer surfaces of the outermost current correctors 12, 12 ofthe cell structure 20 in terms of the thickness direction of the cellstructure 20, an electrode plate 24 of a lead terminal/electrode plateassembly 21 is disposed. Heating is performed at a predeterminedtemperature (for example, 85° C.) for a predetermined period of time(for example, 2 hours) to thereby unify the electrode plates eachprovided with a lead terminal with the cell structure 20.

[0096] Thereafter, the electrodes each provided with a lead terminal andthe cell structure 20 which have been unified is packaged in an outerpackaging with end portions of the lead terminals out by fusion-bondinga peripheral portion of the outer packaging in an atmosphere havingreduced pressure to seal the outer packaging. An electric double layercapacitor 1 is thereby completed.

[0097] In this embodiment, the cell structure comprising a laminatedbasic cells is described. However, the cell structure may comprise asingle basic call having its surface each provided with an electrodeplate 24.

[0098] The above-described method is innovative in that pressures arenot directly applied to the members constituting the basic cell 10 butapplied to the members via the substrates 100, 100 a in the preparationof the basic cell 10. When the basic cell 10 is miniaturized, mechanicalstrengths of the members of the basic cell 10 which include the currentcollectors 12, 12 are lowered concomitantly with the miniaturization.However, since the substrates 100, 100 a serve as reinforcing membersfor the current collectors 12, 12 and the gasket elements 141, 141 tosupport these members, the current collectors 12, 12 and the gasketelements 141, 141 are less likely to undergo separation therebetween ordeformation thereof by pressures applied thereto in the preparation ofthe basic cell 10. This leads to increased productivity of the basiccell 10.

[0099] Another important effect of the present invention obtained by theuse of the substrates 100, 100 a is reside in that a phenomenon oftransmission of vaporized electrolytic solution through the currentcollectors 12, 12 is suppressed which is caused in the fusion-bonding(step). When the members are reduced in size, the phenomenon becomesconsiderable. However, this problem can be solved by using a materialwhich is resistant to transmission of vaporized electrolytic solutiontherethrough for the substrates 100, 100 a.

[0100] Accordingly, a material for the substrates 100, 100 a preferablyhas such physical properties that the substrates 100, 100 a have a vaportransmission rate of about 10 mg/m²/24 h or lower measured in accordancewith JIS Z 0206 test method when diluted sulfuric acid is used as theelectrolyte solution. In other words, amount of the transmittedvaporized electrolytic solution is about 10 mg or smaller in 24 hoursper m². By using the material having such properties for the substrates100, 100 a in the above-described method, the basic cells 10 show asmall range of variation in performance, particularly in ESR even if thebasic cells 10 are miniaturized.

[0101] Of materials which satisfy suitability as the reinforcing memberand the level of the transmission rate, it is particularly preferred touse a polyethylene terephthalate (PET) film as the substrate 100, 100 a.A PET film not only satisfies the suitability and the level because ofits excellent mechanical strength and a low vapor transmission rate butalso shows a small dimensional change by thermal stress. Accordingly,precision and yield in the preparation are maintained at high levelseven if the basic cell 10 is miniaturized. With respect to the thicknessthereof, a thickness of about 100 μm is sufficient.

[0102] If the substrates 100, 100 a has a small thickness and a vaportransmission rate of higher than about 10 mg/m²/24 h, there is a highpossibility that leakage of the electrolytic solution becomenon-negligible to impair basic characteristics of the capacitor.

[0103] It is preferred that prior to the step of removing the substrates100, 100 a in the above-described method, the following steps of heatingand cooling be carried out. This is because occurrence of defects in thestep of removing is inhibited.

[0104] When the current collectors 12, 12 have a glass transitiontemperature higher than that of the substrates 100, 100 a are used, thesteps of heating and cooling are preferably carried out prior to thestep of removing the substrates in such a manner that the structure intowhich the substrates 100, 100 a, the current collectors 12, 12, thegasket 14 and the separator 11 are united, i.e., the structure resultingfrom the step of fusion-bonding the gasket elements is placed in anenvironment having a temperature which is equal to the glass transitiontemperature of the substrates 100, 100 a or higher and which is lowerthan the glass transition temperature of the current collectors 12, 12,and subsequently, the resultant is placed in an environment having atemperature which is room temperature or lower.

[0105] By employing these steps, adhesion between the current collectors12, 12 and the substrates 100, 100 a is weakened due to the differencebetween the glass transition temparature of the current collectors 12,12 and that of the substrates 100, 100 a, and accordingly, thesubstrates 100, 100 a are easily removed from the current collectors 12,12.

EXAMPLES

[0106] The description of the following specific Examples is given byway of illustration for more clear understanding of the presentinvention. In Examples, preferred embodiments of the present inventionare described. It is, however, to be understood that the presentinvention is by no means restricted to these specific Examples.

Example 1

[0107] A current collector in the form of a thin film was bonded to asurface of a substrate in the form of a thin film which had a surfacearea larger than that of the current collector with a release agentinterposed therebetween in such a manner that an uncovered marginalportion of the surface of the substrate was formed around the currentcollector (when viewed in plan) and that the uncovered marginal portionhad such a shape as to allow a gasket element which will be describedbelow to be disposed thereon. The current collector in the form of athin film was made of a styrene-ethylene-butylene-styrene copolymerresin as disclosed in PCT/JP98/01021 and had a size of 3 cm×3 cm and athickness of 80 μm. The substrate in the form of a thin film had athickness of 100 μm and was made of a PET having a vapor transmissionrate of 10 mg/m²/24 h or lower (amount of transmitted vapor is 10 mg orsmaller in 24 hours per m²) measured in accordance with JIS Z 0208 testmethod with respect to diluted sulfuric acid.

[0108] Thereafter, a gasket element in the form of a frame having anopening for accommodating the current collector was disposed on theuncovered portion of the substrate in such a manner that the currentcollector laterally abutted on the gasket element to define a concavity.The gasket element in the form of a frame had a height of 140 μm and wasmade of a colorless and transparent electrical insulating polyolefinicionomer film having a specific gravity of about 0.93 to about 0.97. Thegasket element and the current collector were fusion-bonded. Thefusion-bonding was performed at a temperature of 120° C. for 10 minutes.Then, a polarizable electrode impregnated with an aqueous solution ofsulfuric acid as an electrolytic solution was placed on the surface ofthe current collector. (The resulting product is referred to as anintermediate product.) The polarizable electrode was made of a sinteredproduct prepared by sintering an activated carbon powder and had a sizeof 3 cm×3 cm and a thickness of 45 μm.

[0109] Then, a separator having a substantially planar form was disposedon the gasket element in such a manner that the gasket element abuttedon a peripheral portion of the separator and that an uncovered portionof the upper end of the gasket element was formed around the separator(when viewed in plan). The separator was made of a polypropylene and hasa size of 3.5 cm×3.5 cm and a thickness of 25 μm.

[0110] In this Example, the height of the gasket element was 140 μm.Accordingly, the value of quotient obtained by dividing the valueresulting from subtraction of the thickness of the polarizable electrodefrom the distance between the current collector and the separator by thethickness of the separator was 0.6.

[0111] Further, another intermediate product as a counterpartintermediate product was mounted on the separator in such a manner thatthe two intermediate products were oppositely disposed on the separator.In this case also, the counterpart intermediate product was disposed onthe separator in such a manner that the gasket element abutted on aperipheral portion of the separator and that an uncovered portion of theend surface of the gasket element which end surface was distal to thesubstrate was formed around the separator (when viewed in plan). Inother words, the two intermediate products were so disposed on theseparator as to hold the separator therebetween with the polarizableelectrodes oppositely disposed relative to the separator.

[0112] Then, the two gasket elements were fusion-bonded together into agasket at a temperature of 120° C. for 10 minutes to unite theintermediate products and the separator. A basic cell with thesubstrates was thereby prepared.

[0113] Subsequently, the basic cell with the substrates was allowed tostand in an environment having a temperature of 120° C. for 10 minutes.Then, the basic cell with the substrates was allowed to stand in anenvironment having a temperature of 25° C. for 1 hour.

[0114] Thereafter, two substrates were removed from the basic cell toobtain the basic cell.

[0115] A cell structure was prepared by laminating 5 basic cellsobtained as described above. On each of the outer surfaces of the twooutermost current collectors of the cell structure in terms of thethickness direction of the cell structure, an electrode plate of a leadterminal/electrode plate assembly was disposed, and the electrode plateseach provided with a lead terminal and the cell structure were united byheating at 85° C. for 2 hours to obtain an electric double layercapacitor. With respect to the electric double layer capacitor obtainedas described above, ESR was 22 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 1.2%.

Example 2

[0116] A sheet of thin film for current collectors was bonded to asurface of a substrate in the form of a sheet of thin film which had asurface area substantially the same as that of the sheet of thin filmfor current collectors with a release agent interposed therebetween. Thesheet of thin film for current collectors was made of astyrene-ethylene-butylene-styrene copolymer resin as disclosed inPCT/JP98/01021 and had a thickness of 80 μm. The substrate in the formof a sheet of thin film had a thickness of 100 μm and was made of a PEThaving a vapor transmission rate of 10 mg/m²/24 h or lower (amount oftransmitted vapor is 10 mg or smaller in 24 hours per m²) measured inaccordance with JIS Z 0208 test method with respect to diluted sulfuricacid.

[0117] Then, cutting only the sheet of film for current collectors whichhad been applied onto the substrate, i.e., so-called “halfway cutting”was conducted to form a plurality of current collectors having a size of3 cm×3 cm in such an arrangement that adjacent current collectors wereapart form each other at a distance of 3 cm, and as a result of thehalfway cutting, an uncovered portion of the surface of the substratewas formed around the current collectors when viewed in plan.Thereafter, with respect to each of the current collectors, a gasketelement in the form of a frame having an opening for accommodating acurrent collector was disposed on the uncovered portion of the substratein such a manner that the current collector laterally abutted on thegasket element to define a concavity. The gasket element in the form ofa frame had a height of 140 μm and was made of a colorless andtransparent electrical insulating polyolefinic ionomer film having aspecific gravity of about 0.93 to about 0.97. The gasket element and thecurrent collector were fusion-bonded. The fusion-bonding was performedat a temperature of 120° C. for 10 minutes.

[0118] Then, with respect to each of the products resulting from theimmediately proceeding step, a polarizable electrode impregnated with anaqueous solution of sulfuric acid as an electrolytic solution was placedon the surface of the current collector to prepare an intermediateproduct. The polarizable electrode was made of a sintered productprepared by sintering an activated carbon powder and has a size of 3cm×3 cm and a thickness of 45 μm.

[0119] Then, with respect to each of the intermediate products, aseparator having a substantially planar form is disposed on the gasketelement in such a manner that the gasket element abuts on a peripheralportion of the separator and that an uncovered portion of the upper endof the gasket element was formed around the separator (when viewed inplan). The separator was made of a polypropylene and has a size of 3.5cm×3.5 cm and a thickness of 25 μm.

[0120] In this Example, the height of the gasket element was 140 μm.Accordingly, the value of quotient obtained by dividing the valueresulting from subtraction of the thickness of the polarizable electrodefrom the distance between the current collector and the separator by thethickness of the separator was 0.6.

[0121] Through the above-described steps, a plurality of theintermediate products on each of which one of the separators wasdisposed were provided on the substrate.

[0122] Separately, another substrate provided with a plurality ofintermediate products as counterpart intermediate products was prepared.This was mounted on the separators in such a manner that each pair ofintermediate products disposed on the different substrates wereoppositely disposed on the separator. Each pair of the intermediateproducts were so disposed on the separator as to hold the separatortherebetween with the polarizable electrodes oppositely disposedrelative to the separator.

[0123] Then, two gasket elements of each pair of the intermediateproducts were fusion-bonded together into a gasket at a temperature of120° C. for 10 minutes to unite the intermediate products and theseparator. A plurality of basic cells with the substrates were therebyprepared.

[0124] Subsequently, the basic cells with the substrates were allowed tostand in an environment having a temperature of 120° C. for 10 minutes.Then, the basic cells with the substrates were allowed to stand in anenvironment having a temperature of 25° C. for 1 hour.

[0125] Thereafter, two substrates were removed from the basic cells toobtain a plurality of the basic cells en bloc. A cell structure wasprepared by laminating 5 basic cells obtained as described above. Oneach of the outer surfaces of the two outermost current collectors ofthe cell structure in terms of the thickness direction of the cellstructure, an electrode plate 24 of a lead terminal/electrode plateassembly 21 was disposed, and the electrode plates each provided with alead terminal and the cell structure were united by heating at 85° C.for 2 hours to obtain an electric double layer capacitor. With respectto the electric double layer capacitor obtained as described above, ESRwas 22 mΩ, and percent defective attributed to leakage of theelectrolytic solution during the preparation of the electric doublelayer capacitor was 1.2%.

Example 3

[0126] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the gasket elements had a height of130 μm. In this case, the value of quotient obtained by dividing thevalue resulting from subtraction of the thickness of the polarizableelectrode from the distance between the current collector and theseparator by the thickness of the separator was 0.2.

[0127] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 22 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 1.2%.

Example 4

[0128] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the gasket elements had a height of150 μm. In this case, the value of quotient obtained by dividing thevalue resulting from subtraction of the thickness of the polarizableelectrode from the distance between the current collector and theseparator by the thickness of the separator was 1.0.

[0129] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 49 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 0.3%.

Example 5

[0130] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the gasket elements had a height of160 μm. In this case, the value of quotient obtained by dividing thevalue resulting from subtraction of the thickness of the polarizableelectrode from the distance between the current collector and theseparator by the thickness of the separator was 1.4.

[0131] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 120 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 0.0%.

Example 6

[0132] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the gasket elements had a height of125 μm. In this case, the value of quotient obtained by dividing thevalue resulting from subtraction of the thickness of the polarizableelectrode from the distance between the current collector and theseparator by the thickness of the separator was 0.

[0133] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 19 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 8.2%.

Example 7

[0134] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the current collectors had athickness of 100 μm and the gasket elements had a height of 160 μm.

[0135] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 43 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 0.9%.

Example 8

[0136] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the current collectors had athickness of 15 μm and the gasket elements had a height of 75 μm.

[0137] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 17 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 10.1%.

Example 9

[0138] An electric double layer capacitor was prepared in the samemanner as in Example 1 except that the substrates had a thickness of 20μm. The substrates had a vapor transmission rate of higher than 10mg/m²/24 h measured in accordance with JIS Z 0208 test method.

[0139] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 22 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 11.5%.

Comparative Example 1

[0140] The same preparation method as in Example 1 was carried out up tothe step of fusion-bonding the current collector and the gasket elementwhich had been disposed on the substrate. Then, the substrate wasremoved. Subsequently, the same procedure as in Example 1 was resumed toprepare an electric double layer capacitor.

[0141] With respect to the electric double layer capacitor as obtainedin this manner, ESR was 30 mΩ, and percent defective attributed toleakage of the electrolytic solution during the preparation of theelectric double layer capacitor was 30.4%.

What is claimed is:
 1. An electric double layer capacitor comprising: aseparator having a substantially planar form; a pair of currentcollectors having a plate-like shape and disposed oppositely relative tothe separator and in parallel with the separator; a pair of polarizableelectrodes having a plate-like form and disposed between the separatorand the current collectors; and a gasket in the form of a frame disposedin laterally contiguous relation to the separator and the currentcollectors in such a manner that the gasket is laterally contiguous tothe separator and the current collectors to accomodate the polarizableelectrodes in a pair of closed vacancies defined by the separator, thecurrent collectors and the gasket; each of said closed vacanciescontaining an electrolytic solution.
 2. A electric double layercapacitor according to claim 1, wherein the outer surface of each of thecurrent collectors is coplanar with the nearer end surface of the gasketor apart from the plane including the nearer end surface of the gasketat a distance of about 20 μm or smaller.
 3. A electric double layercapacitor according to claim 1, wherein the gasket is made of a resinhaving a transparency of at least such a degree that the currentcorrector can be seen through the gasket.
 4. A electric double layercapacitor according to claim 1, wherein the gasket is made of apolyolefin film.
 5. A electric double layer capacitor according to claim4, wherein the gasket is made of an ionomer.
 6. A electric double layercapacitor according to claim 1, wherein the current collector has athickness of larger than about 15 μm to about 200 μm.
 7. A electricdouble layer capacitor according to claim 1, wherein quotient obtainedby dividing the value resulting from subtraction of the thickness of thepolarizable electrode from the distance between the current collectorand the separator by the thickness of the separator is in a range ofabout 0.2 to about 0.6.
 8. A method for preparing en electric doublelayer capacitor, said method comprising steps of: (A) applying a currentcollector having a plate-like form onto a surface of a substrate in sucha manner that an uncovered portion of the substrate is formed around thecurrent collector; (B) disposing a gasket element in the form of a framehaving an opening for accommodating the current collector on theuncovered portion of the substrate in such a manner that the currentcollector laterally abuts on the gasket element to define a concavity;(C) placing a polarizable electrode impregnated with an electrolyticsolution in the concavity defined by the current collector and thegasket element; (D) oppositely disposing two intermediate productsprepared through the steps (A) to (C) on a separator having asubstantially planar form in such a manner that the gasket elements abuton surfaces of a peripheral portion of the separator; (E) fusion-bondingthe gasket elements together to laterally cover the separator with theresulting unified gasket to unite the two intermediate products and theseparator; and (F) removing the substrates from the current collectorsand the gasket.
 9. A method for preparing an electric double layercapacitor according to claim 8, wherein the substrate has a vaportransmission rate of about 10 mg/m²/24 h or lower measured in accordancewith JIS Z 0208 test method when provided that diluted sulfuric acid isused as an electrolytic solution.
 10. A method for preparing an electricdouble layer capacitor according to claim 8, wherein the substrate is apolyethylene terephthalate film.
 11. A method for preparing an electricdouble layer capacitor according to claim 8, wherein the currentcollectors have a glass transition temperature higher than that of thesubstrate, said method further comprises between the steps (E) and (F),steps of: (a) placing the product resulting from the step (E) in anenvironment having a temperature which is equal to the glass transitiontemperature of the substrate or higher and which is lower than the glasstransition temperature of the current collector; and subsequently (b)placing the resultant in an environment having a temperature which isroom temperature or lower.
 12. A method for preparing an electric doublelayer capacitor according to claim 8, wherein a plurality of currentcollectors are applied onto the substrate in the step (A) and whereinthe current collectors on the substrate in the step (A), the resultingproducts on the substrate from each of the steps (B) and (C) and theresulting products on between the substrates from the step (D) are enbloc subjected to the next steps (B) to (E), respectively.